Wafer level packaging of MEMS
- 期刊名称Journal of Micromechanics and Microengineering
- 作者Esashi, Masayoshi
- 卷第18卷
- 期第7期
- 印刷ISSN0960-1317
- 电子ISSN1361-6439
- 文件大小2314.34KB
- 发表时间2008-07-01
- DOI10.1088/0960-1317/18/7/073001
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