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[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Lid cooling for notebooks

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Lid cooling for notebooks

Varadarajan, Krishnakumar; Mongia, Rajiv K.; Pokharna, Himanshu; Pan, Jerry; Tien, Kevin; Wu, Mark
  • 作者Varadarajan, Krishnakumar; Mongia, Rajiv K.; Pokharna, Himanshu; Pan, Jerry; Tien, Kevin; Wu, Mark
  • 文件大小624.28KB
  • 发表时间2008
  • DOI10.1109/ITHERM.2008.4544322
  • 页码591-597
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