[IEEE 2008 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) - San Jose, CA, USA (2008.11.10-2008.11.13)] 2008 IEEE/ACM International Conference on Computer-Aided Design - Area-I/O flip-chip routing for chip-package co-design
- 作者Jia-Wei Fang, ; Yao-Wen Chang,
- 文件大小413.17KB
- 发表时间2008
- DOI10.1109/iccad.2008.4681624
- 页码518-522
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