[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Environmentally friendly electronics for high reliability
- 作者McElroy, J. B.; Pfahl, R. C.
- 文件大小117.82KB
- 发表时间2008
- DOI10.1109/icept.2008.4607068
- 页码1-3
同作者推荐
Insulation performance of pressurized liquid helium under quench-induced thermal bubble disturbance for superconducting power apparatusChigusa, S.; Maeda, H.; Taniguchi, Y.; Hayakawa, N.; Okubo, H. · IEEE Transactions on Dielectrics and Electrical Insulation · 1999
[IEEE Conference Record of the 1998 IEEE International Symposium on Electrical Insulation - Arlington, VA, USA (7-10 June 1998)] Conference Record of the 1998 IEEE International Symposium on Electrical Insulation (Cat. No.98CH36239) - Breakdown characteristics of pressurized liquid helium under quench condition of superconducting wiresChigusa, S.; Maeda, H.; Taniguchi, Y.; Hayakawa, N.; Okubo, H. · 1998