[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Investigation of Interconnect Design on Chip Package Interaction and Mechanical Reliability of Cu/Low-k Multi-Layer Interconnects in Flip Chip Package
- 作者Uchibori, Chihiro J.; Zhang, Xuefeng; Ho, Paul S.; Nakamura, Tomoji
- 文件大小537.25KB
- 发表时间2008
- DOI10.1109/iitc.2008.4546952
- 页码150-152
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