Finite Element Analysis of the Effect of Residual Stress on Mechanical Behavior of Welded Plates
- 期刊名称Materials Science Forum
- 作者Goo, Byeong Chun; Yang, Seung Yong
- 电子ISSN1662-9752
- 文件大小515.37KB
- 发表时间2008
- DOI10.4028/www.scientific.net/MSF.580-582.605
- 页码605-608
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