[IEEE 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Shanghai (2008.7.28-2008.7.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Proceedings, 2008 international conference on electronic packaging technology & high density packaging (ICEPT-HDP 2008)
- 文件大小67.72KB
- 发表时间2008
- DOI10.1109/icept.2008.4606931
- 页码1-1
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