发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Li, Dezhi; Liu, Changqing; Conway, Paul P.

期刊名称Journal of Electronic Packaging
作者Li, Dezhi; Liu, Changqing; Conway, Paul P.
卷第130卷
期第1期
印刷ISSN1043-7398
文件大小754.42KB
发表时间2008
DOI10.1115/1.2837522

← 返回【学霸图书馆】主页