Thermal Characterization of Copper Microchannel Heat Sink for Power Electronics Cooling
- 期刊名称Journal of Thermophysics and Heat Transfer
- 作者Singh, Randeep; Akbarzadeh, Aliakbar; Mochizuki, Masataka; Nguyen, Thang; Nguyen, Tien
- 卷第23卷
- 期第2期
- 印刷ISSN0887-8722
- 电子ISSN1533-6808
- 文件大小2828.98KB
- 发表时间2009-04
- DOI10.2514/1.40033
- 页码371-380