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[IEEE 2009 IEEE International Test Conference (ITC) - Austin, TX, USA (2009.11.1-2009.11.6)] 2009 International Test Conference - Testing 3D chips containing through-silicon vias

[IEEE 2009 IEEE International Test Conference (ITC) - Austin, TX, USA (2009.11.1-2009.11.6)] 2009 International Test Conference - Testing 3D chips containing through-silicon vias

Marinissen, Erik Jan; Zorian, Yervant

作者Marinissen, Erik Jan; Zorian, Yervant
文件大小568.76KB
发表时间2009
DOI10.1109/TEST.2009.5355573
页码1-11

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