Polymer‐metal nano‐composite films for thermal management
- 期刊名称Microelectronics International
- 作者Carlberg, Björn; Wang, Teng; Liu, Johan; Shangguan, Dongkai
- 卷第26卷
- 期第2期
- 印刷ISSN1356-5362
- 文件大小793.86KB
- 发表时间2009-05-08
- DOI10.1108/13565360910960213
- 页码28-36
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