[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - 3D circuit model for 3D IC reliability study
- 作者Tan, Cher Ming; Feifei He,
- 文件大小15443.91KB
- 发表时间2009
- DOI10.1109/ESIME.2009.4938513
- 页码1-7
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