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Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate

Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate

Xiaoyun Ding; Fei Geng; Le Luo

作者Xiaoyun Ding; Fei Geng; Le Luo
卷第86卷
期第3期
印刷ISSN0167-9317
文件大小658.25KB
发表时间2009
DOI10.1016/j.mee.2008.11.005
页码335-339

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