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[IEEE 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts - Vancouver, British Columbia, Canada (2009.09.14-2009.09.16)] 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts - Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests

[IEEE 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts - Vancouver, British Columbia, Canada (2009.09.14-2009.09.16)] 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts - Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests

Zhou, Yilin; Pecht, Michael
  • 作者Zhou, Yilin; Pecht, Michael
  • 文件大小5327.10KB
  • 发表时间2009
  • DOI10.1109/holm.2009.5284380
  • 页码324-333
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