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SIMULTANEOUS DOUBLE-SIDE GRINDING OF SILICON WAFERS: A REVIEW AND ANALYSIS OF EXPERIMENTAL INVESTIGATIONS

SIMULTANEOUS DOUBLE-SIDE GRINDING OF SILICON WAFERS: A REVIEW AND ANALYSIS OF EXPERIMENTAL INVESTIGATIONS

Qin, Na; Pei, Z. J.; Fisher, Graham R.; Liu, J.
  • 期刊名称Machining Science and Technology
  • 作者Qin, Na; Pei, Z. J.; Fisher, Graham R.; Liu, J.
  • 卷第13卷
  • 期第3期
  • 印刷ISSN1091-0344
  • 电子ISSN1532-2483
  • 文件大小1817.87KB
  • 发表时间2009-08-31
  • DOI10.1080/10910340903237673
  • 页码285-316
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