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In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical Polishing

In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical Polishing

Kang, Min Cheol; Kim, Yung Jun; Kim, Jae Jeong
  • 期刊名称Electrochemical and Solid-State Letters
  • 作者Kang, Min Cheol; Kim, Yung Jun; Kim, Jae Jeong
  • 卷第12卷
  • 期第9期
  • 印刷ISSN1099-0062
  • 文件大小178.10KB
  • 发表时间2009
  • DOI10.1149/1.3159828
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