Effect of nanoscale surface topography on low temperature direct wafer bonding process with UV activation

• 作者Zirong Tang; Ping Peng; Tielin Shi; Guanglan Liao; Lei Nie; Shiyuan Liu
• 卷第151卷
• 期第1期
• 印刷ISSN0924-4247
• 文件大小1294.61KB
• 发表时间2009
• DOI10.1016/j.sna.2009.01.023
• 页码81-86