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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Technology impact analysis for 3D TCAM

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Technology impact analysis for 3D TCAM

Oh, Eun Chu; Franzon, Paul D.

作者Oh, Eun Chu; Franzon, Paul D.
文件大小191.41KB
发表时间2009
DOI10.1109/3dic.2009.5306563
页码1-5

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