[ASME ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences - San Francisco, California, USA (July 19–23, 2009)] Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment - Development of a Quantitative Nanoscale Thermal Conductivity Profiling Technique by the Removal of Influence Due to Heat Transfer Through the Air
Kim, Kyeongtae; Chung, Jaehoon; Hwang, Gwangseok; Kwon, Ohmyoung; Lee, Joon Sik; Park, Seungho; Choi, Young Ki
- 作者Kim, Kyeongtae; Chung, Jaehoon; Hwang, Gwangseok; Kwon, Ohmyoung; Lee, Joon Sik; Park, Seungho; Choi, Young Ki
- 文件大小337.40KB
- 发表时间2009
- DOI10.1115/HT2009-88618
- 页码543-547