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[ASME ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences - San Francisco, California, USA (July 19–23, 2009)] Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment - Development of a Quantitative Nanoscale Thermal Conductivity Profiling Technique by the Removal of Influence Due to Heat Transfer Through the Air

[ASME ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences - San Francisco, California, USA (July 19–23, 2009)] Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment - Development of a Quantitative Nanoscale Thermal Conductivity Profiling Technique by the Removal of Influence Due to Heat Transfer Through the Air

Kim, Kyeongtae; Chung, Jaehoon; Hwang, Gwangseok; Kwon, Ohmyoung; Lee, Joon Sik; Park, Seungho; Choi, Young Ki
  • 作者Kim, Kyeongtae; Chung, Jaehoon; Hwang, Gwangseok; Kwon, Ohmyoung; Lee, Joon Sik; Park, Seungho; Choi, Young Ki
  • 文件大小337.40KB
  • 发表时间2009
  • DOI10.1115/HT2009-88618
  • 页码543-547
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