8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology
Uksong Kang; Hoe-Ju Chung; Seongmoo Heo; Duk-Ha Park; Hoon Lee; Jin Ho Kim; Soon-Hong Ahn; Soo-Ho Cha; Jaesung Ahn; DukMin Kwon; Jae-Wook Lee; Han-Sung Joo; Woo-Seop Kim; Dong Hyeon Jang; Nam Seog Kim; Jung-Hwan Choi; Tae-Gyeong Chung; Jei-Hwan Yoo; Joo Sun Choi; Changhyun Kim; Young-Hyun Jun
- 作者Uksong Kang; Hoe-Ju Chung; Seongmoo Heo; Duk-Ha Park; Hoon Lee; Jin Ho Kim; Soon-Hong Ahn; Soo-Ho Cha; Jaesung Ahn; DukMin Kwon; Jae-Wook Lee; Han-Sung Joo; Woo-Seop Kim; Dong Hyeon Jang; Nam Seog Kim; Jung-Hwan Choi; Tae-Gyeong Chung; Jei-Hwan Yoo; Joo Sun Choi; Changhyun Kim; Young-Hyun Jun
- 卷第45卷
- 期第1期
- 印刷ISSN0018-9200
- 电子ISSN1558-173X
- 文件大小2420.78KB
- 发表时间2010
- DOI10.1109/jssc.2009.2034408
- 页码111-119