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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Dielectric property of nickel/calcium copper titanate/Polyvinylidene Fluoride composite

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Dielectric property of nickel/calcium copper titanate/Polyvinylidene Fluoride composite

Wenhu Yang, ; Shuhui Yu, ; Rong Sun, ; Ruxu Du,

作者Wenhu Yang, ; Shuhui Yu, ; Rong Sun, ; Ruxu Du,
文件大小966.93KB
发表时间2010
DOI10.1109/ICEPT.2010.5583799
页码460-463

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