[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Global outlook for embedded device packaging
Bauer, Charles E.; Neuhaus, Herbert J.
- 作者Bauer, Charles E.; Neuhaus, Herbert J.
- 文件大小32.15KB
- 发表时间2010
- DOI10.1109/impact.2010.5699675
- 页码1-1