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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The role of glaze in TPH analysis by CFD

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The role of glaze in TPH analysis by CFD

Hsiao, Clay; Huang, Baron; Su, Feimi

作者Hsiao, Clay; Huang, Baron; Su, Feimi
文件大小168.14KB
发表时间2010
DOI10.1109/impact.2010.5699510
页码1-4

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