Characterization and impact of reduced copper plating overburden on 45 nm interconnect performances
- 作者O. Dubreuil; V. Caubet-Hilloutou; J. Guillan; K. Haxaire; M. Mellier; P. Caubet; P. Vannier; E. Petitprez; D. Bellet; Ph. Normandon
- 卷第87卷
- 期第3期
- 印刷ISSN0167-9317
- 文件大小1358.32KB
- 发表时间2010
- DOI10.1016/j.mee.2009.07.002
- 页码421-425
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