[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Experimental investigation of oblique finned microchannel heat sink⁺

• 作者Lee, Yong-Jiun; Lee, Poh-Seng; Chou, Siaw-Kiang
• 文件大小953.67KB
• 发表时间2010
• DOI10.1109/itherm.2010.5501362
• 页码1-7