发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Development of low temperature dielectrics down to 150°C for multiple TSVs structure with Wafer-on-Wafer (WOW) technology

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Development of low temperature dielectrics down to 150°C for multiple TSVs structure with Wafer-on-Wafer (WOW) technology

Kitada, H.; Maeda, N.; Fujimoto, K.; Mizushima, Y.; Nakata, Y.; Nakamura, T.; Lee, W.; Kwon, Y-S.; Ohba, T.

作者Kitada, H.; Maeda, N.; Fujimoto, K.; Mizushima, Y.; Nakata, Y.; Nakamura, T.; Lee, W.; Kwon, Y-S.; Ohba, T.
文件大小798.95KB
发表时间2010
DOI10.1109/iitc.2010.5510744
页码1-3

← 返回【学霸图书馆】主页