[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Numerical-experimental analysis of combined bulk and interface fracture in a leadless package

• 作者Noijen, Sander; Walczyk, Sven; Groenhuis, Roelf; van der Sluis, Olaf
• 文件大小6780.92KB
• 发表时间2010
• DOI10.1109/esime.2010.5464532
• 页码1-4