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Metal–dielectric interface toughening by molecular nanolayer decomposition

Metal–dielectric interface toughening by molecular nanolayer decomposition

Garg, Saurabh; Jain, Ashutosh; Karthik, C.; Singh, Binay; Teki, Ranganath; Smentkowski, V. S.; Lane, Michael W.; Ramanath, Ganpati
  • 期刊名称Journal of Applied Physics
  • 作者Garg, Saurabh; Jain, Ashutosh; Karthik, C.; Singh, Binay; Teki, Ranganath; Smentkowski, V. S.; Lane, Michael W.; Ramanath, Ganpati
  • 卷第108卷
  • 期第3期
  • 印刷ISSN0021-8979
  • 文件大小1321.35KB
  • 发表时间2010
  • DOI10.1063/1.3437648
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