[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Study on high reliable design method for lead-free solder joints on electronic components
Takagi, Kanji; Yu, Qiang; Shibutani, Tadahiro; Noro, Yukihiro
- 作者Takagi, Kanji; Yu, Qiang; Shibutani, Tadahiro; Noro, Yukihiro
- 文件大小403.93KB
- 发表时间2010
- DOI10.1109/itherm.2010.5501281
- 页码1-8