Flexible embedded circuitry: A novel process for high density, cost effective electronics
- 作者Jeroen van den Brand; Roel Kusters; Marco Barink; Andreas Dietzel
- 卷第87卷
- 期第10期
- 印刷ISSN0167-9317
- 文件大小1668.13KB
- 发表时间2010
- DOI10.1016/j.mee.2009.11.004
- 页码1861-1867
Successive Softening and Cyclic Damage in Viscoplastic MaterialLadani, Leila J. · Journal of Electronic Packaging · 2010
Estimating fatigue damage model constants with maximum likelihood methodLadani, Leila J. · International Journal of Materials and Structural Integrity · 2008
Temperature Effects in Al 5083 with a Bimodal Grain SizeMagee, Andrew C.; Ladani, Leila J. · MRS Proceedings · 2013
A meso-scale damage evolution model for cyclic fatigue of viscoplastic materialsLeila J. Ladani; Abhijit Dasgupta · 2009
An anisotropic mechanical fatigue damage evolution model for Pb-free solder materialsLeila J. Ladani; Jafar Razmi · 2009
Fatigue Crack Initiation and Propagation in Aileron Lever Using Successive-Initiation Modeling ApproachGyllenskog, James; Ladani, Leila J. · Journal of Aircraft · 2011
Effects of tensile test parameters on the mechanical properties of a bimodal Al–Mg alloyAndrew Magee; Leila Ladani; Troy D. Topping; Enrique J. Lavernia · 2012