Development of a Copper Chemical Mechanical Polishing Slurry at Neutral pH Based on Ceria Slurry
- 期刊名称Journal of The Electrochemical Society
- 作者Kim, Yung Jun; Kwon, Oh Joong; Kang, Min Cheol; Suh, Myung-Won; Im, Young; Kim, Jae Jeong
- 卷第157卷
- 期第10期
- 印刷ISSN0013-4651
- 文件大小396.99KB
- 发表时间2010
- DOI10.1149/1.3473801
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