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ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Simultaneous Double Side Grinding of Silicon Wafers: A Further Investigation into Grinding Marks Pattern

ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Simultaneous Double Side Grinding of Silicon Wafers: A Further Investigation into Grinding Marks Pattern

Li, Zhichao; Lin, Bin; Sun, Wangping; Zhang, Xiaohong

作者Li, Zhichao; Lin, Bin; Sun, Wangping; Zhang, Xiaohong
印刷ISSN1938-5862
文件大小288.99KB
发表时间2010
DOI10.1149/1.3360650
页码395-400

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