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Application of ultrasonic iterative deconvolution technique to the case of internal defect detection in multi-layered PCB components

Application of ultrasonic iterative deconvolution technique to the case of internal defect detection in multi-layered PCB components

Raišutis, R; Tumšys, O; Kažys, R; Mažeika, L

期刊名称Insight - Non-Destructive Testing and Condition Monitoring
作者Raišutis, R; Tumšys, O; Kažys, R; Mažeika, L
卷第52卷
期第1期
印刷ISSN1354-2575
文件大小4795.49KB
发表时间2010-01
DOI10.1784/insi.2010.52.1.27
页码27-33

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