Bondability of Cu wire on Cu substrate with Sn plating by ultrasonic
- 期刊名称QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
- 作者FUJIWARA, Shinichi; DAUSKARDT, Reinhold H.
- 卷第28卷
- 期第4期
- 印刷ISSN0288-4771
- 文件大小3059.49KB
- 发表时间2010
- DOI10.2207/qjjws.28.362
- 页码362-368
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