Formation of Ag3Sn plates in SnAgCu solder bumps
- 作者Jicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt
- 卷第527卷
- 印刷ISSN0921-5093
- 文件大小871.47KB
- 发表时间2010
- DOI10.1016/j.msea.2009.12.020
- 页码2588-2591
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