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[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Recent advance in solder ball interconnections reliability examination

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Recent advance in solder ball interconnections reliability examination

Svecova, Olga; Nicak, Michal; Kosina, Petr; Sandera, Josef

作者Svecova, Olga; Nicak, Michal; Kosina, Petr; Sandera, Josef
文件大小798.41KB
发表时间2011
DOI10.1109/isse.2011.6053868
页码253-257

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