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Creep behaviour of Sn–3.8Ag–0.7Cu under the effect of electromigration: Experiments and modelling

Creep behaviour of Sn–3.8Ag–0.7Cu under the effect of electromigration: Experiments and modelling

Fei Su; Ronghai Mao; Xiaoyan Wang; Guangzhou Wang; Haiyan Pan

作者Fei Su; Ronghai Mao; Xiaoyan Wang; Guangzhou Wang; Haiyan Pan
卷第51卷
期第5期
印刷ISSN0026-2714
文件大小469.31KB
发表时间2011
DOI10.1016/j.microrel.2011.01.010
页码1020-1024

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