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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Study on the heat dissipation of the thermal via in T/R modules based on BP-GA

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Study on the heat dissipation of the thermal via in T/R modules based on BP-GA

Bi, Tang-wen; Zhou, De-jian

作者Bi, Tang-wen; Zhou, De-jian
文件大小970.01KB
发表时间2011
DOI10.1109/icept.2011.6066926
页码1-3

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