[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
- 作者Oprins, H.; Cherman, V.; Vandevelde, B.; Torregiani, C.; Stucchi, M.; Van der Plas, G.; Marchal, P.; Beyne, E.
- 文件大小2178.87KB
- 发表时间2011
- DOI10.1109/ectc.2011.5898612
- 页码861-868
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