Solder Pump Technology for Through-Silicon via Fabrication
- 期刊名称Journal of Microelectromechanical Systems
- 作者Gu, Jiebin; Pike, W. T.; Karl, W. J.
- 卷第20卷
- 期第3期
- 印刷ISSN1057-7157
- 电子ISSN1941-0158
- 文件大小363.42KB
- 发表时间2011-06
- DOI10.1109/jmems.2011.2127460
- 页码561-563
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