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Effects of the Functional Groups of Complexing Agents and Cu Oxide Formation on Cu Dissolution Behaviors in Cu CMP Process

Effects of the Functional Groups of Complexing Agents and Cu Oxide Formation on Cu Dissolution Behaviors in Cu CMP Process

Kim, Yung Jun; Kwon, Oh Joong; Kang, Min Cheol; Kim, Jae Jeong

期刊名称Journal of The Electrochemical Society
作者Kim, Yung Jun; Kwon, Oh Joong; Kang, Min Cheol; Kim, Jae Jeong
卷第158卷
期第2期
印刷ISSN0013-4651
文件大小381.65KB
发表时间2011
DOI10.1149/1.3522811

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