ECS Transactions [ECS 220th ECS Meeting - Boston, MA (October 9 - October 14, 2011)] - Copper-ALD Seed Layer as an Enabler for Device Scaling
Mao, Jiajun; Eisenbraun, Eric; Omarjee, Vincent; Korolev, Andrey; Dussarrat, Christian
- 作者Mao, Jiajun; Eisenbraun, Eric; Omarjee, Vincent; Korolev, Andrey; Dussarrat, Christian
- 印刷ISSN1938-5862
- 文件大小311.15KB
- 发表时间2011
- DOI10.1149/1.3633652
- 页码33-39