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ECS Transactions [ECS 220th ECS Meeting - Boston, MA (October 9 - October 14, 2011)]  - Copper-ALD Seed Layer as an Enabler for Device Scaling

ECS Transactions [ECS 220th ECS Meeting - Boston, MA (October 9 - October 14, 2011)] - Copper-ALD Seed Layer as an Enabler for Device Scaling

Mao, Jiajun; Eisenbraun, Eric; Omarjee, Vincent; Korolev, Andrey; Dussarrat, Christian
  • 作者Mao, Jiajun; Eisenbraun, Eric; Omarjee, Vincent; Korolev, Andrey; Dussarrat, Christian
  • 印刷ISSN1938-5862
  • 文件大小311.15KB
  • 发表时间2011
  • DOI10.1149/1.3633652
  • 页码33-39
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