Table of contents
- 期刊名称IEEE Transactions on Antennas and Propagation
- 作者Maci, Stefano; Heyman, Ehud; Bertoni, Henry L.
- 卷第59卷
- 期第3期
- 印刷ISSN0018-926X
- 电子ISSN1558-2221
- 文件大小45.22KB
- 发表时间2011-03
- DOI10.1109/tap.2011.2119350
ErratumMercado, L.L.; Wieser, H.; Hauck, T. · IEEE Transactions on Advanced Packaging · 2003
Modeling and Analyzing Vertical InterconnectionsMantysalo, M.; Ristolainen, E.O. · IEEE Transactions on Advanced Packaging · 2006
Intelligent SOP ManufacturingMay, G.S. · IEEE Transactions on Advanced Packaging · 2004
Multichip module photovoltaic miniarraysOrtego, P.R.; Bermejo, S.; Castaner, L.M. · IEEE Transactions on Advanced Packaging · 2001
ForewordRahal-Arabi, T. · IEEE Transactions on Advanced Packaging · 2005
Reaction analysis in stripline circuitsKabir, S.; Dvorak, S.L.; Prince, J.L. · IEEE Transactions on Advanced Packaging · 2001
Optoelectronic/VLSIGoossen, K.W. · IEEE Transactions on Advanced Packaging · 1999
Foreword Three-Dimensional PackagingBauer, C.E.; Lee, S.W.R. · IEEE Transactions on Advanced Packaging · 2005