Ceramic Integration and Joining Technologies (From Macro to Nanoscale) || The Changing Physics in Metal Interconnect Reliability
Singh, Mrityunjay; Ohji, Tatsuki; Asthana, Rajiv; Mathur, Sanjay
- 作者Singh, Mrityunjay; Ohji, Tatsuki; Asthana, Rajiv; Mathur, Sanjay
- 文件大小3853.91KB
- 发表时间2011
- DOI10.1002/9781118056776.ch14
- 页码415-447