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Thermal conductivity enhancement of BN/silicone composites cured under electric field: Stacking of shape, thermal conductivity, and particle packing structure anisotropies

Thermal conductivity enhancement of BN/silicone composites cured under electric field: Stacking of shape, thermal conductivity, and particle packing structure anisotropies

Yuwang Han; Sumin Lv; Chanxi Hao; Fei Ding; Yi Zhang

作者Yuwang Han; Sumin Lv; Chanxi Hao; Fei Ding; Yi Zhang
卷第529卷
印刷ISSN0040-6031
文件大小783.23KB
发表时间2012
DOI10.1016/j.tca.2011.11.029
页码68-73

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