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Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

Xiaoyun Cui; David A. Hutt; Paul P. Conway
  • 作者Xiaoyun Cui; David A. Hutt; Paul P. Conway
  • 卷第520卷
  • 期第19期
  • 印刷ISSN0040-6090
  • 文件大小753.05KB
  • 发表时间2012
  • DOI10.1016/j.tsf.2012.05.068
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