High Density Metal–Metal Interconnect Bonding for 3-D Integration
- 作者Lannon, J.M.; Gregory, C.; Lueck, M.; Reed, J.D.; Huffman, C.A.; Temple, D.
- 卷第2卷
- 期第1期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小2250.90KB
- 发表时间2012
- DOI10.1109/tcpmt.2011.2175922
Livres reçusKhoshafian (S.); Buckiewicz (M.); Birien (J.-L.); Date (C. J.); Bouillant (O.); Lopez (N.); Migueis (J.); Pichon (E.); Meyr (H.); Moeneclaey (M.); Fechtel (S. A.); Nägeli (H.) · 1998
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