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Effect of material damage on the spallation threshold of single crystal copper: a molecular dynamics study

Effect of material damage on the spallation threshold of single crystal copper: a molecular dynamics study

Rawat, S; Warrier, M; Chaturvedi, S; Chavan, V M
  • 期刊名称Modelling and Simulation in Materials Science and Engineering
  • 作者Rawat, S; Warrier, M; Chaturvedi, S; Chavan, V M
  • 卷第20卷
  • 期第1期
  • 印刷ISSN0965-0393
  • 电子ISSN1361-651X
  • 文件大小1521.41KB
  • 发表时间2012-01-01
  • DOI10.1088/0965-0393/20/1/015012
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