[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Thermal resistance investigations on new leadframe-based LED packages and boards

Pardo, B.; Gasse, A.; Fargeix, A.; Jakovenko, J.; Werkhoven, R.J.; Perpina, X.; Van Weelden, T.; Bancken, P.

作者Pardo, B.; Gasse, A.; Fargeix, A.; Jakovenko, J.; Werkhoven, R.J.; Perpina, X.; Van Weelden, T.; Bancken, P.
文件大小2091.65KB
发表时间2012
DOI10.1109/ESimE.2012.6191750

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