发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Low temperature plasma activated direct wafer bonding

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Low temperature plasma activated direct wafer bonding

Plach, T.; Hingerl, K.; Dragoi, V.; Wimplinger, M.

作者Plach, T.; Hingerl, K.; Dragoi, V.; Wimplinger, M.
文件大小634.40KB
发表时间2012
DOI10.1109/LTB-3D.2012.6238072
页码145-145

← 返回【学霸图书馆】主页